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US 4,475,223 AGranted
Exposure process and system
AssigneeHitachi, Ltd.
InventorsMotoya Taniguchi, Mitsuyoshi Koizumi, Nobuyuki Akiyama, Yukio Kembo, Minoru Ikeda
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AssigneeHitachi, Ltd.
InventorsMotoya Taniguchi, Mitsuyoshi Koizumi, Nobuyuki Akiyama, Yukio Kembo, Minoru Ikeda
Estimating the term…
An X ray exposure process and system for transferring a mask pattern onto a wafer with use of X rays, wherein heights on the mask at many points are measured on a light interference band basis by a mask-height measuring device of non-contact measurement type at an X ray exposure position, the mask being mounted on a chamber which is filled with a He gas and or the like to prevent attenuation of an X ray source, heights on the wafer at many points are measured at a wafer-height measuring position different from said exposure position, and according to the measured results, the wafer is finely moved upwardly or downwardly (that is, deformed) individually independently by means of a chuck which sucks and holds the wafer at many points thereon so that, a gap between the mask and wafer is adjusted to a desired level.
In an exposure process for transferring a mask pattern onto a wafer, the steps of measuring heights on the mask surface at many points by a mask-height measuring device and measuring heights on the wafer surface at many points by a wafer-height measuring device, deforming the wafer by means of a chuck which sucks and holds the wafer at many points thereon and finely moves the wafer at said many points upwardly or downwardly individually and independently according to said measured results, and adjusting a gap between the mask and the wafer to a predetermined value for enabling proper transfer of the mask pattern onto the wafer during the exposure process.
In an exposure system for transferring onto a wafer a circuit pattern formed on a mask, a chuck provided with means for sucking and holding the wafer at many points thereon and for finely moving the wafer at said many points upwardly or downwardly individually and independently;
Dependencies are inferred from the claim text.