Wafer holding apparatus and method

A method of simultaneously processing multiple wafers in a reaction chamber that includes a multifaceted electrode, each of said facets having plural spaced-apart pedestals, said method comprising the steps of

• mounting plural wafers in each of a number of apertured plates by inserting the wafers into the respective apertures from the back sides of the plates to bring edge portions of each wafer into resilient engagement with spring-mounted retaining elements affixed to the plates around the periphery of each of the apertures, the front surface of each such mounted wafer being recessed within its respective aperture,
• and mounting the wafer-carrying plates on the respective facets of said electrode to maintain the back surfaces of the wafers in respective contact with the top surfaces of the pedestals and to thereby establish the front surface of each wafer in the same plane as the front side of its associated plate.

Processing apparatus comprising a reaction chamber,

• an electrode within said chamber, said electrode having at least one pedestal member,
• a wafer-retaining assembly comprising a plate having at least one wafer-receiving aperture therethrough, said assembly including means mounted on said plate and disposed around the periphery of each aperture for resiliently engaging and securely holding a wafer within the aperture independent of whether or not said assembly is mounted on said electrode,
• and means for mounting said assembly on said electrode to establish a major portion of the back surface of each wafer held within an aperture of said plate in resilient engagement with the top surface of a respective aligned pedestal member.

Processing apparatus comprising a reaction chamber,

• an electrode within said chamber, said electrode having at least one pedestal member,
• and means for mounting a wafer to be processed on said electrode, said mounting means comprising a plate having at least one water-receiving aperture therethrough and elements mounted on said plate and disposed around the periphery of each aperture for resiliently engaging and securely holding a wafer within the aperture independent of whether or not said plate is positioned on the electrode in said reaction chamber, whereby when the plate is positioned on said electrode with the aperture(s) in respective alignment with the pedestal member(s), the back surface of each wafer held within an aperture of said plate is established in resilient engagement with the top surface of an aligned pedestal member.