Dustfree packaging container and method
AssigneeMicro Lithography, Inc.
InventorYung-Tsai Yen
Life of this patent
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Abstract
A dust and contamination free packaging container is provided. A method of producing contamination free packaging is also included. The package includes mating exterior frame members and spacing blocks for displacing a packaged product from the interior walls of the frame. The interior frame surfaces are coated with a contact adhesive which captures and retains particulate matter with which it comes into contact. Prior to use the contact adhesive surfaces are protected by cover sheets or elements which are readily removed at the time the product is to be inserted into the container. The predominant usage of the containers and method is in the electronic and optical industries and particularly in the packaging of photomask pellicles.
Claims19
A method for providing a substantially dustfree interior to a sealed container, in steps comprising:
- a. installing spacing means within the container such that the article or articles placed therein are separated from at least a portion of the interior surfaces of the container, the spacing means being selected to provide no loose particulate matter;
- and
- b. coating the exposed non-article-contacting interior surface of the container with a layer of contact adhesive.
The method of 3 wherein:
- the spacing means are semirigid blocks formed to conform to the outside shape of the articles being contained.
A dustless container for packaging one or more articles comprising:
- a first frame member;
- a second frame member adapted to mate with the first frame member to form a sealable enclosed volume therewithin;
- spacing means for preventing the articles from contacting the interior surfaces of the first and second frame members;
- and
- a layer of contact adhesive applied to at least some of the surfaces of the first and second frame members which are exposed within said enclosed volume.
Dependencies are inferred from the claim text.