Formaldehyde depressed particle board
OwnerStanley Wawzonekinventor
Life of this patent
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Abstract
A method and particle board composition which employs urea formaldehyde resin adhesive, but which is formaldehyde suppressed by adding to the formaldehyde resin, a small but suppression effective amount of a weak acid and calcium metal silicate.
Claims19
A method of preparing formaldehyde suppressed particle board which employs a formaldehyde resin adhesive for bonding the particles of said board, comprising:
- uniformly coating particles used in making said board with a adhesive mixture which is a formaldehyde resin containing a small but formaldehyde suppressing effective amount of a weak acid which is substantially inert to formaldehyde resins, and calcium metasilicate, and pressing the coated particles into a particle board.
A method of preparing formaldehyde suppressed particle board which employs urea formaldehyde resin for bonding the particles of said board, comprising:
- uniformly coating particles used in making said board with a small but effective amount of an aqueous solution of boric acid;
- mixing urea formaldehyde resin with a small but suppression effective amount of a calcium metasilicate;
- uniformly coating said mixed resin on said particles;
- and
- pressing said coated particles into a particle board form.
A urea formaldehyde resin containing particle board of substantially reduced formaldehyde outgassing properties, said board comprising:
- about 90% of wood chips;
- about 10% of a urea formaldehyde resin mix;
- said mixing containing a small but suppression effective amount of calcium metasilicate and a weak acid which is substantially inert to urea formaldehyde resin.
Dependencies are inferred from the claim text.