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US 4,448,844 AGranted
Heat resistant resin and process for producing the same
AssigneeHitachi Chemical Company, Ltd.
InventorsYuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima, Yoshiyuki Mukoyama, Hiroshi Nishizawa
Life of this patent
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Abstract
A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
Claims8
An insulated wire comprising a coating of a heat resistant resin composition on an electric conductor;
- said heat resistant resin composition comprising a heat resistant resin and a phenolic solvent;
- the heat resistant resin being produced by reacting with heating
- (A) a polyamideimide resin obtained by reacting in a phenolic solvent the following components (a) to (e):
- (a) a polyisocyanate containing an isocyanurate ring in an amount of 0 to 30 equivalent percents based on the total isocyanate equivalent,
- (b) a diisocyanate free of an isocyanurate ring,
- (c) a lactam,
- (d) a tricarboxylic acid anhydride, and
- (e) a compound different from the component (d) and selected from the group consisting of trimesic acid, tris(2-carboxyethyl) isocyanurate, 3,3',4,4'-butanetricarboxylic acid, anhydrides thereof and a reaction product of trimellitic anhydride and a trimer of isophorone diisocyanate or a trimer of tolylene diisocyanate, in an amount of 0 to 30 equivalent percents based on the total carboxyl equivalent, with
- (B) an alcohol component selected from the group consisting of a di- or higher polyhydric alcohol and a mixture of a di- or higher polyhydric alcohol with a monohydric alcohol, and
- (C) an acid component selected from the group consisting of a divalent or higher polyvalent carboxylic acid, an ester thereof and an anhydride thereof.
7 more elements
Dependencies are inferred from the claim text.