Photoresistive compositions

Abstract

Photographic and Photolithographic systems are provided which utilize diacetylenic materials as components thereof. Such materials, which include at least two acetylenic bonds in conjugation with one another, provide a combination of both high sensitivity and high resolving power, thus resulting in superior photographic and photolithographic properties. In accordance with a preferred embodiment of the invention, a substrate is coated with at least one layer of a polymerizable composition comprising a diacetylenic species, said layer being organized into a plurality of domains having a substantially regular array of the diacetylenic species. In other embodiments, covalent bonding of the diacetylenic layer to the substrate is accomplished through the use of suitably constituted silane species, thus to provide a highly beneficial adhesion of substrate and photo- or photolithographic layer.

Dependencies are inferred from the claim text.