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AssigneeHitachi, Ltd.
InventorsMamoru Kobayashi, Kanji Ishige, Hideaki Sasaki, Mitsukiyo Tani, Yashuhiko Kawakami
Estimating the term…
A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.
An automatic wiring machine for a printed circuit board comprising an X-Y table carrying the printed circuit board to be applied with wirings and movable in X and Y directions, and a head located above said X-Y table and rotatably supported by a main console of the machine to rotate about an axis perpendicular to the surface of said X-Y table, said head being mounted with a wire guide unit for guiding the feed of a wire for wiring to the surface of said printed circuit board, a bonding unit for bonding at a bonding point the wire fed from said wire guide unit to a conductor pattern on said printed circuit board by heating and depressing the fed wire, and a cutter unit for cutting away the wire at a site deviating from said bonding point to said wire guide unit, said wire guide, bonding and cutting units being mounted on said head for linear movement along lines which are inclined with respect to said axis, and the acting points of said wire guide, bonding and cutter units on the printed circuit board being substantially concentrated on said axis;
Dependencies are inferred from the claim text.