Adjacent bilinear photosite imager
AssigneeXerox Corporation
InventorsJames C. Stoffel, Jagdish C. Tandon, Ned J. Seachman
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Abstract
A high density charge coupled device imaging array 28 with a bilinear array 30, 32 of photosites on a single integrated circuit chip is utilized in an image scanning configuration. Offset photosites 30a, 32a in two rows are coupled via transfer gates 36 to storage register 38 and then to shift register 44, and via transfer gates 34 to shift register 42. The output of these two shift registers 42, 44 are multiplexed to generate a single output pulse train representative of the information scanned.
Claims12
A high density charge coupled device imaging array (28) on a single integrated circuit chip, wherein the improvement is characterized by,
- a first row (32) of photosite means deposited on said integrated circuit chip, said photosite means being sensitive to applied light information representative of one scan line of data,
- a second row (30) of photosite means deposited on said integrated circuit chip adjacent to and contiguous with said first row of photosite means, said second row of photosite means being offset from said first row of photosite means approximately one-half the length of individual photosite means on said first row such that said second row of photosite means are sensitive to applied light information in the same said one scan line of data intermediate the photosite means in said first row of photosite means, said first and second rows of photosite means comprising a bilinear array of photosite means.
A high density charge coupled device imaging array (28) on a single integrated circuit chip for use in detection of information contained in repetitive line scans, comprising:
- a first row (32) of photosite means formed on said integrated circuit chip, said photosite means being sensitive to applied light information in one scan line in the form of data bits by depositing electronic charge in the substrate of said chip in response to said applied light information,
- a second row (32) of photosite means formed on said integrated circuit chip immediately adjacent to and contiguous with said first row (32) of photosite means, said second row (32) of photosite means being offset from said first row of photosite means intermediate the centers of the photosite means in said first row of photosite means such that said second row of photosite means are sensitive to applied light information in one scan line in the form of data bits by depositing electronic charge in the substrate of said chip in response to applied light information intermediate the photosite means on said first row of photosite means, said first and second rows of photosite means comprising a bilinear array of photosite means which consecutively scan the same lines of information in a raster scan type of arrangement.
A high density charge coupled device imaging array (28) on a single integrated circuit chip, comprising:
- a first row (32) of photosite means deposited on said integrated circuit chip, said photosite means being sensitive to applied light information,
- a second row of photosite means deposited on said integrated circuit chip adjacent to and contiguous with said first row of photosite means, said second row of photosite means being offset from said first row of photosite means approximately one-half the length of individual photosite means on said first row such that said second row of photosite means are sensitive to applied light information intermediate the photosite means in said first row of photosite means, said first and second rows of photosite means comprising a bilinear array of photosite means, each of said photosite means in said first and second rows having width, w, and height, h, approximately related by w=2kh, where k is the ratio of the horizontal sampling pitch, S.sub.x to vertical sampling pitch, S.sub.y.
Dependencies are inferred from the claim text.