Filaments of high tensile strength and modulus
AssigneeStamicarbon B.V.
InventorsPaul Smith, Pieter J. Lemstra
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Abstract
The invention relates to the preparation of filaments with a high tensile strength and a high modulus and to the filaments thus prepared. A solution of a linear polyethylene with a weight-average molecular weight of at least 4.times.10.sup.5 is spun and the filaments, from which the solvent may have been removed in whole or in part, are drawn using a draw ratio of at least (12.times.10.sup.6 /M.sub.w)+1. The filaments are drawn at a temperature such that the modulus is at least 20 GPa. The invention allows filaments to be prepared at high drawing rates, of 0.5 sec.sup.-1 or more, with a modulus of at least 20 GPa and a tensile strength of at least 1 GPa.
Claims2
A solution-spun and drawn high molecular weight M.sub.w polyethylene filament of combined high modulus and high tensile strength wherein
- said molecular weight M.sub.w is at least 8.times.10.sup.5,
- said modulus is at least 20 GPa,
- said tensile strength is at least 2 GPa.
A solution-spun and drawn high molecular weight M.sub.w polyethylene filament of combined high modulus and high tensile strength wherein
- said molecular weight M.sub.w is at least 8.times.10.sup.5,
- said modulus is at least 20 GPa,
- said tensile strength is at least 2 GPa,
- and wherein
- said filament has been drawn at a draw ratio of at least (12.times.10.sup.6 /M.sub.w)+1.
Dependencies are inferred from the claim text.