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US 4,428,814 AGranted
Electroplating apparatus with constant velocity agitation
AssigneeSperry Corporation
InventorTsu-Fang Chen
Life of this patent
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Abstract
Apparatus is disclosed, for mechanically agitating, in a non-reciprocating manner, a permalloy composition used in an electroplating procedure, in such a way as to apply a film of improved uniformity of composition and thickness thus avoiding limitations of prior electroplating processes which, due to uneven boundary layer flow patterns caused by reciprocating agitation, result in non-uniformities in film composition and thickness.
Claims7
Electroplating apparatus with constant velocity agitation comprising:
- a reservoir;
- at least one anode in said reservoir;
- at least one cathode in said reservoir;
- first means for agitating a fluid in said reservoir, said means including an endless first belt having a plurality of paddles on a first surface thereof, said first belt operably connected for movement at a constant velocity in a first direction and having a second surface adjacent said anode;
- second means for agitating a fluid in said reservoir, said means including an endless second belt having a plurality of paddles on a first surface thereof opposite said first belt paddles, said second belt operably connected for movement at a constant velocity in a second direction, opposite said first direction, and having a second surface adjacent said cathode;
- and
- said reservoir including a sidewall having a plurality of baffles connected thereto.
4 more elements
Dependencies are inferred from the claim text.