Palladium-nickel alloy electroplating and solutions therefor

In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.

In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and adding to the plating solution at least one sulfo compound selected from the group consisting of naphthalene sulfonic acid, naphthalene sulfonates, aromatic sulfonamides, derivatives thereof and mixtures thereof for providing more lustrous plating, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.

In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving ammonium nickel sulfate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.

In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving nickel acetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.

In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving disodium nickel ethylenediamine-tetraacetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.