US 4,416,056 AGranted

Process for preparation of film coils

AssigneeFujitsu Limited

InventorYoshio Takahashi

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Abstract

A process for the preparation of film coils is disclosed, which comprises forming a first plane coil layer by arranging a plurality of insulated spiral conductor patterns wound in the same direction adjacent to one another without any gaps, laminating on the first plane coil layer a second plane coil layer formed by arranging a similar plurality of spiral conductor patterns wound in the reverse direction, and connecting the conductor patterns in the first plane coil layer to the conductor patterns in the second plane coil alternately through windows in the insulation separating the plane coil layers to form one coil. The flatness of the resulting structure allows plane coil layers to be laminated to form a stack. The resulting coils may be employed to produce a multi-track recording head with minimal distance between the heads, transformers, and other inductors, including center-tapped inductors.

Claims4

Dependent claims

A process for the preparation of thin-film coils, which comprises:

forming a first plane coil layer having a flat top face by arranging a plurality of first spiral conductor patterns wound in the same direction, each of said first conductor patterns being positioned on the same plane adjacent to one another and being insulated from one another;
forming an insulating layer on said first plane coil layer, said insulating layer having a plurality of selectively positioned apertures therein such that each of said conductor patterns is exposed by at least one aperture;
and forming and laminating on said insulating layer a second plane coil layer which overlaps some of said plurality of apertures by arranging a plurality of second spiral conductor patterns wound in a direction opposite to that of said plurality of first spiral conductor patterns of the first plane coil layer, each of said second conductor patterns being positioned on the same plane adjacent to one another and being insulated from one another, the conductor patterns in the first plane coil layer being directly connected through said apertures to the conductor patterns in the second plane coil layer alternatively to form one coil comprising all of said conductor patterns thus directly connected in series.

Dependencies are inferred from the claim text.