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US 4,412,030 AGranted
Hot melt adhesive compositions employing resins based on 2-methyl styrene, styrene and a phenol
AssigneeNational Starch and Chemical Corporation
InventorsYves Runavot, Georges Billault, Jaques Salvetat
Life of this patent
Estimating the term…
Abstract
Resins suitable for adhesives are based on .alpha.-methyl styrene, styrene and phenol in certain percentages, viz. 25 to 63, 35 to 73 and 2 to 15 percent by weight, respectively. Combinations of resin, ethylene vinyl acetate copolymer, atactic polypropylene, ethyl acrylate copolymer or a thermoelastomer and optionally a wax or tackifying oil yield excellent adhesives, in particular hot-melt adhesives.
Claims9
A hot melt adhesive composition comprising:
- (a) a first resin having an average molecular weight of 400 to 2,000, based on .alpha.-methyl styrene, stryene and a phenol as constitutents, characterized in that the weight percentages of .alpha.-methyl styrene, styrene and a phenol with a structural formula ##STR2## in which R is hydrogen or a C.sub.1 -C.sub.12 alkyl group, which compounds are substantially the sole constituents, range from 25 to 63, from 35 to 73 and from 2 to 15 parts by weight of the resin, respectively;
- and
- (b) a second resin selected from the group consisting essentially of copolymers of ethylene vinyl acetate containing 25-65% vinyl acetate, atactic polypropylene, ethylacrylate copolymers, natural rubbers and synthetic rubbers.
Dependencies are inferred from the claim text.