Method of manufacturing a laser source with stamped support
AssigneeThomson-CSF
InventorsEugene Duda, Claude Tondu, Alain Maumy
Life of this patent
Estimating the term…
Abstract
The invention relates to laser sources using a semiconductor chip from which the radiation is collected by an optical fiber. In accordance with the invention there is provided a laser source in which the support for the semiconductor chip and the optical fiber is metallic. The support is stamped with an impression comprising a seat for the semiconductor chip and at least one groove for accommodating the optical fiber. The invention is applicable to radiation sources used in optical telecommunication systems.
Claims2
A method of manufacturing a semiconductor laser source including a laser chip and at least one optical fiber for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of:
- stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least one Vee-shaped groove, acting as a recess for said optical fiber;
- disposing said chip on said flattened area;
- and
- disposing said at least one optical fiber in said at least one Vee-shaped groove, said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped groove at such a width and depth below said surface that light emitted from said chip is directed to said at least one fiber.
A method of manufacturing a semiconductor laser source including a laser chip and at least two optical fibers for collecting the radiation supplied from said laser chip on a support made of a cold-malleable metal of high thermal conductivity, said method comprising the steps of:
- stamping, in a single operation, said support to permanently deform said support to have on a surface of said support, a flattened area and at least first and second Vee-shaped grooves, said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove;
- said first Vee-shaped groove being disposed between said flattened area and said second Vee-shaped groove;
- disposing said chip on said flattened area;
- disposing one of said at least two optical fibers in said first Vee-shaped groove;
- and
- disposing another of said at least two optical fibers in said second Vee-shaped groove,
- said stamping step forming said flattened area at such a depth below said surface and said Vee-shaped grooves at such a width and depth below said surface that light emitted from said chip is directed to first said one fiber acting as a cylindrical lens and then to said another fiber.
Dependencies are inferred from the claim text.