Wood composites of low formaldehyde emission
AssigneeBorden, Inc.
InventorJames H. Williams
Life of this patent
Estimating the term…
Abstract
A process for bonding lignocellulosic material under heat and pressure, where the bonded lignocellulosic material is characterized by a low emission of formaldehyde, which comprises applying a binder to said lignocellulosic material, said binder comprising a urea-formaldehyde base resin having a ratio of formaldehyde to urea of 1.0:1-1.2:1, said base resin having essentially no free formaldehyde and said base resin when cured containing substantially more methylene groups than methylene ether groups, consolidating said lignocellulosic material and curing the binder.
Claims31
A process for bonding lignocellulosic material under heat and pressure, where the bonded lignocellulosic material is characterized by a low emission of formaldehyde, which comprises
- applying a binder to said lignocellulosic material, said binder comprising a urea-formaldehyde base resin having a molar ratio of formaldehyde to urea of 1.0:1-1.2:1, said base resin having essentially no free formaldehyde and said base resin when cured containing substantially more methylene groups than methylene ether groups,
- consolidating said lignocellulosic material and curing the binder.
An improved pressed composite of lignocellulosic material bound together by a urea-formaldehyde binder, which composite is characterized by reduced emission of formaldehyde, wherein the improvement comprises using as said binder a urea-formaldehyde base resin having a molar ratio of formaldehyde to urea of 1.0:1-1.2:1, said base resin having no free formaldehyde and said base resin when cured contains substantially more methylene groups then methylene ether groups.
A process for adhesively securing a first item to a second using a curable urea-formaldehyde resin, comprising
- disposing between a first item and a second item a curable urea-formaldehyde resin having a molar ratio of formaldehyde to urea of 1.0:1-1.2:1, said resin containing essentially no free formaldehyde and being curable to a structure containing substantially more methylene groups than methylene ether groups, and then
- curing said resin to bind said items together.
A process for bonding lignocellulosic material under heat and pressure, where the bonded lignocellulosic material is characterized by a low emission of formaldehyde, which comprises
- applying a binder to said lignocellulosic material, said binder comprising a amino-formaldehyde base resin having a molar ratio of formaldehyde to amino compound of 1.0:1-1.2:1, said base resin having essentially no free formaldehyde and said base resin when cured containing substantially more methylene groups than methylene ether groups,
- consolidating said lignocellulosic material and curing the binder.
An improved pressed composite of lignocellulosic material bound together by a urea-formaldehyde binder, which composite is characterized by reduced emission of formaldehyde, wherein the improvement comprises using as said binder a amino-formaldehyde base resin having a molar ratio of formaldehyde to amino compound of 1.0:1-1.2:1, said base resin having no free formaldehyde and said base resin when cured contains substantially more methylene groups then methylene ether groups.
A process for adhesively securing a first item to a second using a curable urea-formaldehyde resin, comprising
- disposing between a first item and a second item a curable amino-formaldehyde resin having a molar ratio of formaldehyde to amino compound of 1.0:1-1.2:1, said resin containing essentially no free formaldehyde and being curable to a structure containing substantially more methylene groups than methylene ether groups, and then
- curing said resin to bind said items together.
Dependencies are inferred from the claim text.