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US 4,405,427 AGranted
Electrodeposition of coatings on metals to enhance adhesive bonding
AssigneeMcDonnell Douglas Corporation
InventorNorman R. Byrd
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AssigneeMcDonnell Douglas Corporation
InventorNorman R. Byrd
Estimating the term…
The invention is directed to the electrodeposition of a coating of a phosphorylated amide on a metal such as aluminum, and the formation of a chemical bond between the metal and the coating, such amide being in the form of (a) an organic polymer consisting of a poly (phosphinohydrazide), a poly (phosphinoguanide) or a poly (phosphinoureide), including homopolymers and copolymers thereof, and their thio analogs or (b) a 2:1 molar adduct of a nitrogen-containing compound such as hydrazine, guanidine or urea or its thio analog, and an organic phosphite or phosphonate. In the method of electrolytically depositing such coating on the metal substrate, e.g., aluminum, the substrate is employed as the anode in a non-aqueous or aqueous electrolyte containing a phosphorylated amide of the type noted above, e.g., poly (phosphinohydrazide), and electro-depositing a coating on the metal substrate, the organic coating formed being chemically bonded to the substrate, thereby enhancing adhesive bonding to the metal substrate, such coating being strongly bonded to the substrate and being corrosion resistant.
A process for enhancing adhesive bonding of a metal substrate, which comprises passing an electric current through a non aqueous or aqueous electrolyte in which a metal substrate is the anode, the metal of said substrate being active and capable of forming an organometallic compound, said electrolyte containing a phosphorylated amide having a labile hydrogen, and capable of generating an anion during electrolysis, said phosphorylated amide being in the form of (a) an organic polymer consisting of a poly (phosphinohydrazide), a poly (phosphinoguanide) or a poly (phosphinoureide), including homopolymers and copolymers thereof, and their thio analogs, or (b) a 2:1 molar adduct of two moles of a nitrogen-containing compound of the group consisting of hydrazine, guanidine and urea, and its thio analog, to one mole of and organic phosphite or phosphonate, and their thio analogs, and electrodepositing a coating of said amide on said metal substrate wherein said anion is reacted with and is chemically bonded to the metal of said substrate.
Dependencies are inferred from the claim text.