# US 4,400,682 A · Pressure sensor

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- Number: US 4,400,682 A
- Document ID: US4400682A
- Status: Granted
- Kind: A
- Application number: 06/319,060
- Filed: 1981-11-06
- Granted: 1983-08-23
- Earliest claimed: 1980-11-10
- Assignees: Mitsubishi Denki Kabushiki Kaisha
- Inventors: Kiyoshi Ishibashi
- Web page: https://patentgrep.com/patent/US4400682A

## CPC

- G01L 19/147: {Details about the mounting of the sensor to support or covering means}
- H10W 72/884: {Die-attach connectors and bond wires}
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A pressure sensor comprises: a pressure sensor chip including a diaphragm, a stationary support supporting said diaphragm, and a bed supporting said stationary support, said diaphragm, said stationary support and said bed being made of a semiconductor material and defining a space which is evacuated; a holding box having at least its bottom made of metal and having a hole for internal wiring, said holding box accommodating and holding said pressure sensor chip such that the opposite side to the diaphragm of said pressure sensor chip is in contact with the inner side of said bottom and that said pressure sensor chip is restricted from movement; and a package placing and adhering said holding box in position.

## Claims

### Claim 1

A pressure sensor comprising: a pressure sensor chip including a diaphragm, a stationary support supporting said diaphragm, and a bed supporting said stationary support, said diaphragm, said stationary support and said bed being made of a semiconductor material and defining a space which is evacuated; a holding box having at least its bottom made of metal and having a hole for internal wiring, said holding box accommodating and holding said pressure sensor chip such that the opposite side to the diaphragm of said pressure sensor chip is in contact with the inner side of said bottom and that said pressure sensor chip is restricted from movement; and a package placing and adhering said holding box in position.

### Claim 2 (depends on 1)

A pressure sensor as set forth in claim 1, wherein said semiconductor material is silicon.