# US 4,400,415 A · Process for nickel plating aluminum and aluminum alloys

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- Number: US 4,400,415 A
- Document ID: US4400415A
- Status: Granted
- Kind: A
- Application number: 06/292,580
- Filed: 1981-08-13
- Granted: 1983-08-23
- Earliest claimed: 1981-08-13
- Assignees: Lea-Ronal, Inc.
- Inventors: Richard B. Kessler; Fred I. Nobel
- Web page: https://patentgrep.com/patent/US4400415A

## CPC

- C25D 5/44: Aluminium
- C23C 18/1841: {with use of metal first}
- C23C 18/32: Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A process for the electrolytic or electroless deposition of a coating of nickel on an aluminum or aluminum alloy substrate which comprises immersing the substrate in a hydroxide solution having a pH of about 12 or above, a nickel or cobalt compound soluble therein and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above, and electrolytically or electrolessly coating a layer of nickel thereon.

## Claims

### Claim 1

A process for treating aluminum and aluminum alloy substrates to improve the adhesion of subsequently applied electroless or electrolytic nickel deposits which comprises treating the substrate with a solution containing a soluble nickel or cobalt compound having a pH of about 12 or above and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above and which solution is further characterized by the absence of a reducing agent capable of reducing the nickel or cobalt compound to cause a buildup of nickel or cobalt metal on the substrate.

### Claim 2 (depends on 1)

The process of claim 1 in which the pH of the solution is adjusted to about 12 with sodium or potassium hydroxide.

### Claim 3 (depends on 2)

The process of claim 2 in which the complexing agent is a polyamine, a nitrilo carboxylic acid chelating agent, or a phosphonic acid chelating agent.

### Claim 4 (depends on 2)

The process of claim 2 in which ammonia ion is added to the solution.