# US 4,400,331 A · Dialkoxy-phosphonyl-N-alkyl-formic acid amides

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- Number: US 4,400,331 A
- Document ID: US4400331A
- Status: Granted
- Kind: A
- Application number: 06/342,544
- Filed: 1982-01-25
- Granted: 1983-08-23
- Earliest claimed: 1979-09-17
- Assignees: Bayer Aktiengesellschaft
- Inventors: Peter Haas; Heinz Muller; Peter Seifert; Kuno Wagner; Kurt Findeisen; Klaus Konig
- Web page: https://patentgrep.com/patent/US4400331A

## CPC

- C08J 9/0038: {containing phosphorus}
- C07F 9/4065: {Esters of acids containing the structure -C(=X)-P(=X)(XR)2, (X = O, S, Se)}
- C08J 2375/04: Polyurethanes
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C07F: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins C07D487/22)

## Abstract

The present invention relates to a process for the preparation of polyurethane foams capable of being flame laminated and high frequency welded, comprising reacting: (a) polyisocyanate, (b) a compound having a molecular weight of from 400 to 10,000 containing at least two isocyanate-reactive hydrogen atoms and (c) a dialkoxy-phosphonyl-N-alkyl-formic acid amide of the formula: ##STR1## wherein m represents an integer of from 1 to 3, n represents an integer of from 0 to 8, X represents halogen, hydrogen, C.sub.1 to C.sub.6 alkyl, -OR, or ##STR2## R represents C.sub.1 to C.sub.6 alkyl, R.sub.1 represents hydrogen, C.sub.1 to C.sub.10 alkyl, C.sub.1 to C.sub.10 alkylene, C.sub.6 to C.sub.10 aryl or C.sub.6 to C.sub.10 arylene, and R.sub.2 and R.sub.3, which may be the same or different, represent C.sub.1 to C.sub.10 alkyl in the presence of water and/or blowing agent. The present invention also relates to dialkoxy-phosphonyl-N-formic acid amides.

## Claims

### Claim 1

Dialkoxy-phosphonyl-N-alkyl-formic acid amides corresponding to the formulae: ##STR9##
