# US 4,398,117 A · Bellows support for surface acoustic wave device

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- Number: US 4,398,117 A
- Document ID: US4398117A
- Status: Granted
- Kind: A
- Application number: 06/246,464
- Filed: 1981-03-23
- Granted: 1983-08-09
- Earliest claimed: 1981-03-23
- Assignees: Sperry Corporation
- Inventors: Raymond A. St. Cyr
- Web page: https://patentgrep.com/patent/US4398117A

## CPC

- H03H 9/059: {consisting of mounting pads or bumps}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

An improved surface acoustic wave device having an acoustic substrate is mounted on multidirectional deflection structures that provide isolation from shocks and vibration and permit thermal expansion without stress to the acoustic substrate.

## Claims

### Claim 1

An improved surface acoustic wave device of the type having an acoustic substrate and a base wherein the improvement comprises:
bellows shaped mounting means disposed between said substrate and said base for providing multidirectional deflection movement;
first means for attaching said bellows means to said substrate; and
second means for attaching said bellows means to said base.

### Claim 2 (depends on 1)

The device according to claim 1 wherein said bellows mounting material is fabricated from a flexible material.

### Claim 3 (depends on 2)

The device according to claim 2 wherein said flexible material comprises ductile nickel.

### Claim 4 (depends on 2)

The device according to claim 2 wherein said flexible material is a low outgassing, low oxidization material.

### Claim 5 (depends on 4)

The device according to claim 4 wherein said flexible material is gold plated ductile nickel.

### Claim 6 (depends on 1)

The device according to claim 1 wherein said first and second attaching means comprises an adhesive.

### Claim 7 (depends on 6)

The device according to claim 6 wherein said adhesive comprises epoxy resin.

### Claim 8 (depends on 7)

The device according to claim 7 wherein said epoxy resin comprises gold-filled epoxy resin.

### Claim 9 (depends on 6)

The device according to claim 6 wherein said adhesive comprises polyimide resin.

### Claim 10 (depends on 1)

The device according to claim 1 wherein said second attaching means comprises solder.

### Claim 11 (depends on 1)

The device according to claim 1 wherein said second attaching means comprises at least one pin coupled to said base and aligned with the interior of said bellows mounting means.

### Claim 12 (depends on 11)

The device according to claim 11 wherein said interior of said bellows mounting means is aligned in friction fit relation to said pin.

### Claim 13 (depends on 11)

The device according to claim 11 wherein said pin is spot-welded to said bellows mounting means.

### Claim 14 (depends on 11)

The device according to claim 11 further comprising epoxy resin disposed between said pin and said bellows means for providing adhesion therebetween.