# US 4,396,460 A · Method of forming groove isolation in a semiconductor device

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- Number: US 4,396,460 A
- Document ID: US4396460A
- Status: Granted
- Kind: A
- Application number: 06/380,778
- Filed: 1982-05-21
- Granted: 1983-08-02
- Earliest claimed: 1981-06-10
- Assignees: Hitachi, Ltd.
- Inventors: Yoichi Tamaki; Tokuo Kure; Takeo Shiba; Hisayuki Higuchi
- Web page: https://patentgrep.com/patent/US4396460A

## CPC

- H10P 95/066: {the removal being a selective chemical etching step, e.g. selective dry etching through a mask}
- H10P 50/00: Etching of wafers, substrates or parts of devices
- H10P 50/667: {by liquid etching only}
- H10W 10/041: {of isolation regions comprising polycrystalline semiconductor materials}
- H10W 10/40: Isolation regions comprising polycrystalline semiconductor materials
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

After filling grooves with a filling material, this filling material is etched by the use of a double-layer film which is made of substances different from each other. The side etching of the lower film of the double-layer film and the etching of the filling material are alternately performed in such a manner that each etching is carried out a plurality of number of times. Thus, the upper surface of the filling material contained in each groove can be flattened.

## Claims

### Claim 1

A method of manufacturing a semiconductor device, comprising the steps of:
(1) forming a groove in a major surface of a semiconductor substrate,
(2) depositing a filling material on the whole surface of the resultant substrate to fill said groove,
(3) forming two superimposed films made of materials different from each other and the filling material, on the whole surface of the resultant substrate,
(4) forming a resist pattern on parts of said two films overlying said groove,
(5) etching and removing exposed parts of said two films by employing said resist pattern as a mask,
(6) side-etching the lower one of said two films partially beneath the upper film,
(7) partially etching said filling material employing the lower film as a mask, and
(8) performing each of the steps (6) and (7) at least once more, to thereby remove the filling material existing outside said grooves.

### Claim 2 (depends on 1)

A method of manufacturing a semiconductor device as defined in claim 1, wherein said filling material is polycrystalline silicon.

### Claim 3 (depends on 2)

A method of manufacturing a semiconductor device as defined in claim 2, wherein prior to the step (2), an insulating film is formed on surfaces of said groove.

### Claim 4 (depends on 3)

A method of manufacturing a semiconductor device as defined in claim 3, wherein said insulating film is a double-layer film which consists of a silicon dioxide film and a silicon nitride film.

### Claim 5 (depends on 2)

A method of manufacturing a semiconductor device as defined in claim 2, wherein the upper one of said two films deposited in the step (3) is a silicon nitride film, while the lower one is a silicon dioxide film.

### Claim 6 (depends on 2, 5)

A method of manufacturing a semiconductor device as defined in claim 2 or 5, wherein said polycrystalline silicon is etched with an etchant.

### Claim 7 (depends on 6)

A method of manufacturing a semiconductor device as defined in claim 6, wherein said etchant is selected from the group consisting of hydrazine, potassium hydroxide, sodium hydroxide, and a mixed solution consisting of fluoric acid and nitric acid.

### Claim 8 (depends on 1)

A method of manufacturing a semiconductor device as defined in claim 1, wherein said filling material is selected from the group consisting of silicon dioxide, silicon nitride, aluminum oxide, and polyimide isoindoloquinazolinedione.

### Claim 9 (depends on 1)

A method of manufacturing a semiconductor device as defined in claim 1, wherein a plurality of grooves are formed in the major surface of said substrate and said grooves are filled with said filling material.