# US 4,396,140 A · Method of bonding electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 4,396,140 A - Document ID: US4396140A - Status: Granted - Kind: A - Application number: 06/228,954 - Filed: 1981-01-27 - Granted: 1983-08-02 - Earliest claimed: 1981-01-27 - Assignees: Bell Telephone Laboratories, Incorporated - Inventors: Donald Jaffe; Richard C. Kershner; Nicholas T. Panousis - Web page: https://patentgrep.com/patent/US4396140A ## CPC - H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) - H05K 3/3426: {characterised by the leads} - H05K 2201/10166: Transistor - H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive - H05K 2203/0338: Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component - H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate. ## Claims ### Claim 1 A method of applying solder (16, 17, 18) to the leads (28, 29, 30) of an electronic component (14) characterized in the steps of first depositing solder in the form of a paste comprising lead, tin, and a flux on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads of the component, bringing the leads into contact with the solder pads on the substrate, heating the structure to reflow the solder and cause the solder to adhere to each lead, removing the flux from the solder to permit removal of the component from the substrate, and removing the component from the substrate. ### Claim 2 A method for bonding an electronic component (14) to bonding pads (22, 23, 24) on a metallized substrate (21) comprising the steps of applying solder (16, 17, 18) to the leads (28, 29, 30) of the component, bringing said leads into contact with corresponding bonding pads on said metallized substrate, and heating the structure to melt the solder and establish a bond between the leads and bonding pads characterized in that the solder is applied to the leads by first depositing solder in the form of a paste comprising lead, tin and a flux on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads of the component, bringing the leads into contact with the solder pads on the substrate, heating the structure to reflow the solder and cause the solder to adhere to each lead, removing the flux from the solder to permit removal of the component from the unmetallized substrate, and removing the component from the substrate. ### Claim 3 (depends on 2) The method according to claim 2 wherein the unmetallized substrate comprises ceramic. ### Claim 4 (depends on 2) The method according to claim 2 wherein the solder on the unmetallized substrate is reflowed by heating at a peak temperature in the range 190-250 degrees Celsius for a period of 15-60 seconds. ### Claim 5 (depends on 2) The method according to claim 2 wherein the amount of solder adhering to each lead when the component is removed from the unmetallized substrate is at least 1 mg. ### Claim 6 (depends on 2) The method according to claim 2 wherein the metallized substrate comprises ceramic with a thick film circuit (20) formed thereon. ### Claim 7 (depends on 2) The method according to claim 2 wherein the component is a soldered-on transistor. ### Claim 8 (depends on 2) The method according to claim 2 wherein the solder adhering to each lead (e.g., 18 of FIG. 6) has a flat bottom surface (28). ### Claim 9 A method for bonding an electronic component (14) to bonding pads (22, 23, 24) on a metallized substrate (21) comprising the steps of applying solder (16, 17, 18) to the leads (28, 29, 30) of the component, bringing said leads into contact with corresponding bonding pads on said metallized substrate, and heating the structure to melt the solder and establish a bond between the leads and bonding pads characterized in that the solder is applied to the leads by first depositing on an unmetallized substrate (10) a solder paste comprising lead, tin and a flux in a pattern of discrete pads (11, 12, 13) corresponding to the leads of the component, bringing the leads into contact with the solder pads on the substrate, heating the structure at a peak temperature in the range 190-250 degrees Celsius to melt the solder for a period of 15-60 seconds and cause the solder to adhere to each lead while the component remains in place on the unmetallized substrate, removing the flux from the solder, and removing the component from the substrate.