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US 4,395,348 AGranted
Photoresist stripping composition and method
AssigneeEKC Technology, Inc.
InventorWai M. Lee
Life of this patent
Estimating the term…
Abstract
An organic photoresist stripping composition especially for use with silicon wafers having an insulating layer and metallization on the wafers contains an organic sulfonic acid and 1,2 dihydroxybenzene. The composition also preferably includes a polar or nonpolar, organic solvent. This composition will remove both positive and negative photoresist from wafers without attack on either aluminum metallization or silicon dioxide insulation layers when used to contact the photoresist on the wafers.
Claims10
A composition for the removal of an organic photoresist from a substrate, which consists essentially of:
- an organic sulfonic acid and
- 1,2 dihydroxybenzene in sufficient amounts to remove the photoresist from the substrate.
Dependencies are inferred from the claim text.