# US 4,394,710 A · Die-stamped circuit board assembly for photoflash devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 4,394,710 A - Document ID: US4394710A - Status: Granted - Kind: A - Application number: 06/336,532 - Filed: 1982-01-04 - Granted: 1983-07-19 - Earliest claimed: 1980-03-19 - Assignees: GTE Products Corporation - Inventors: Boyd G. Brower; David R. Broadt; John W. Shaffer - Web page: https://patentgrep.com/patent/US4394710A ## CPC - H05K 3/041: {by using a die for cutting the conductive material} - G03B 15/0442: {Constructional details of the flash apparatus; Arrangement of lamps, reflectors, or the like (G03B15/0484 takes precedence)} - G03B 15/0457: {Ignition mechanisms for sequential ignition of flash lamps} - H05K 2203/0108: Male die used for patterning, punching or transferring - Y10T 156/107: Punching and bonding pressure application by punch - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A circuit board assembly wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material. ## Claims ### Claim 1 A circuit board assembly for use within a photoflash device, said circuit board assembly comprising: a dielectric substrate; at least one thin, electrically conductive switching element having a portion thereof die-stamped an established distance within a surface of said substrate; and at least one thin, electrically conductive metallic member die-stamped within said surface of said substrate simultaneously with said switching element and having a part thereof located on said die-stamped portion of said switching element, said die-stamping electrically connecting said conductive member to said portion of said switching element and securedly positioning both said conductive member and said switching element on said dielectric substrate without severing said switching element. ### Claim 2 (depends on 1) The circuit board assembly according to claim 1 wherein said dielectric substrate includes at least one aperture therein, said switching element bridging said aperture. ### Claim 3 (depends on 1) The circuit board assembly according to claim 1 including a first quantity of adhesive material located between said part of said conductive member located on said portion of said switching element and said portion of said switching element. ### Claim 4 (depends on 3) The circuit board assembly according to claim 3 including a second quantity of adhesive material located between said portion of said switching element die-stamped within said dielectric substrate and said substrate. ### Claim 5 (depends on 1) The circuit board assembly according to claim 1 wherein said switching element possesses a greater hardness than said dielectric substrate and said conductive member. ### Claim 6 (depends on 5) The circuit board assembly according to claim 5 wherein said conductive member possesses a hardness greater than said dielectric substrate. ### Claim 7 (depends on 5) The circuit board assembly according to claim 5 wherein said dielectric substrate possesses a thickness greater than said switching element and said conductive member. ### Claim 8 (depends on 7) The circuit board assembly according to claim 7 wherein said conductive member possesses a thickness substantially equal to or greater than said switching element. ### Claim 9 (depends on 5) The circuit board assembly according to claim 5 wherein said switching element is comprised of a polymeric material. ### Claim 10 (depends on 9) The circuit board assembly according to claim 9 wherein said polymeric material is selected from the group consisting of mono- or biaxially oriented polyethylene, polypropylene, polystyrene, polyester, or nylon. ### Claim 11 (depends on 10) The circuit board assembly according to claim 10 wherein said conductive material is comprised of dead soft aluminum. ### Claim 12 (depends on 11) The circuit board assembly according to claim 11 wherein the material of said dielectric substrate is high impact polystyrene. ### Claim 13 (depends on 1) The circuit board assembly according to claim 1 wherein said switching element and said conductive member are electrically connected at two locations by said die-stamping, a first of said locations being along an edge of said conductive member and a second of said locations being along a common boundary between said switching element and said conductive member. ### Claim 14 (depends on 1) The circuit board assembly according to claim 1 wherein said part of said conductive member positioned on said die-stamped portion of said switching element serves to assist in retaining said switching element on said dielectric substrate. ### Claim 15 (depends on 1) The circuit board assembly according to claim 1 wherein said die-stamped portion of said switching element and said part of said conductive member die-stamped within said dielectric substrate are each of a substantially arcuate configuration, the ends of said conductive member being substantially tapered.