# US 4,394,532 A · Multilayer current distribution systems and methods of fabrication thereof

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- Number: US 4,394,532 A
- Document ID: US4394532A
- Status: Granted
- Kind: A
- Application number: 06/249,393
- Filed: 1981-03-31
- Granted: 1983-07-19
- Earliest claimed: 1981-03-31
- Assignees: Rogers Corporation
- Inventors: Arturo J. Aguayo
- Web page: https://patentgrep.com/patent/US4394532A

## CPC

- H02G 5/005: {Laminated bus-bars}
- H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)}
- H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49179: by metal fusion bonding
- H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A miniaturized bus bar is presented wherein a plurality of distribution prongs or fingers are mechanically and electrically bonded to a ribbon type capacitor which is defined by a pair of bus conductors and a ceramic spacer.

## Claims

### Claim 1

A multilayer bus bar assembly including:
capacitor ribbon means, said ribbon means comprising a continuous elongated dielectric member of rectangular cross sections and electrically conductive coatings on a pair of oppositely disposed planar surfaces of the dielectric member; and
a plurality of distribution prong means on each of said planar surfaces, said prong means being comprised of an electrically conductive material, said prong means being mechanically and electrically bonded to respective coatings of said ribbon means.

### Claim 2 (depends on 1)

The bus bar of claim 1 wherein said ribbon means dielectric member is comprised of a ceramic.

### Claim 3 (depends on 2)

The bus bar of claim 2 wherein said ribbon means conductive coatings comprise metallized surfaces of the ceramic member.

### Claim 4 (depends on 3)

The bus bar of claim 3 further comprising:
insulating means encapsulating said ribbon means, said prong means extending through said insulating means.

### Claim 5

A method of forming a bus bar assembly including the following steps:
forming an elongated flat dielectric ceramic wafer having a rectangular cross-section;
applying a layer of conductive material to a pair of opposed surfaces of the flat ceramic wafer; and
electrically and mechanically bonding a plurality of transversely extending conductive distribution prongs to each of the conductive layers on the said opposed surfaces of the flat dielectric ceramic wafer.