# US 4,393,111 A · Fabrication of conductor-clad composites using molding compounds and techniques

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- Number: US 4,393,111 A
- Document ID: US4393111A
- Status: Granted
- Kind: A
- Application number: 06/288,689
- Filed: 1981-07-31
- Granted: 1983-07-12
- Earliest claimed: 1980-02-15
- Assignees: Bell Telephone Laboratories, Incorporated
- Inventors: Theodore H. Klein
- Web page: https://patentgrep.com/patent/US4393111A

## CPC

- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 1/0326: {containing O}
- H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0251: Non-conductive microfibers
- H05K 2201/09118: Moulded substrate
- Y10S 428/901: Printed circuit
- Y10T 428/21: Circular sheet or circular blank
- Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T 428/2907: with coating or impregnation
- Y10T 428/3162: Cross-linked polyester [e.g., glycerol maleate-styrene, etc.]
- Y10T 428/31678: Of metal
- Y10T 428/31681: Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
- Y10T 428/31794: Of cross-linked polyester
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

## Claims

### Claim 1

A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, 60-80 parts by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, 0.5-60 parts by weight; low profile additive, 15-40 parts by weight; catalyst, 0.5-3 parts by weight; filler, 100-200 parts by weight; viscosity control agent, 0-5 parts by weight; and reinforcement, 20-250 parts by weight.

### Claim 2 (depends on 1)

The structure of claim 1 formed from a composition comprising: resin, 65.0 parts by weight .+-.5 percent; monomer, 43.0 parts by weight .+-.5 percent; low profile additive, 35.0 parts by weight .+-.5 percent; catalyst, 1.5 parts by weight .+-.5 percent; filler, 150.0 parts by weight .+-.5 percent; viscosity control agent, 2.5 parts by weight .+-.5 percent; and reinforcement, 85.0 parts by weight .+-.5 percent.

### Claim 3 (depends on 1)

The structure of claim 1 formed from a composition comprising: isophthalic anhydride based unsaturated polyester resin, 65 parts by weight .+-.1 percent; polyvinyl acetate low profile additive, 35 parts by weight .+-.1 percent; styrene, 3 parts by weight .+-.1 percent; 1,1 ditertiary butylperox 3,3,5 dimethyl cyclohexane catalyst, 1 part by weight .+-.1 percent; alumina trihydrate, 150 parts by weight .+-.1 percent; magnesium oxide, 0.8 parts by weight .+-.1 percent; and chopped glass fiber reinforcement, 30 parts by weight .+-.1 percent.

### Claim 4

A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, about 9.709-34.03 percent by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, about 0.08644-23.48 percent by weight; low profile additive, about 2.4470-18.90 percent by weight; catalyst, about 0.07868-1.511 percent by weight; filler, about 18.59-67.56 percent by weight; viscosity control agent, about 0-2.487 percent by weight; and reinforcement, about 4.902-58.68 percent by weight.