Structure for mounting a semiconductor chip to a metal core substrate
AssigneeRCA Corporation
InventorRobert L. Schelhorn
Life of this patent
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Abstract
A porcelain coated steel substrate for receiving thick film printed circuit thereon includes thermally and electrically conductive pedestals which are in thermal and electrical contact with the steel core. The pedestal surface is coplanar with the porcelain coating so that a substantially continuous plane surface is present. This permits semiconductor chips readily to be mounted on the substrate, the pedestals serving as heat and electrical conductors to the substrate, and serves also to facilitate the deposition of thick film elements.
Claims6
A thermally and electrically conductive mounting for a semiconductor chip on a substrate comprising:
- a thermally and electrically conductive substrate having a substantially plane surface;
- a raised thermally and electrically conductive pedestal on said substrate having a surface spaced from and substantially parallel to said plane surface, said semiconductor chip being mounted on said pedestal, said pedestal being in electrical and thermal contact with said plane surface;
- and
- an electrically insulating porcelain layer on said plane surface having an outer surface substantially coplanar with said surface of said pedestal, said porcelain layer abutting said pedestal and forming with said pedestal a continuous plane surface.
Dependencies are inferred from the claim text.