Method of producing smooth metallic layers on a substrate
AssigneeThe United States of America as represented by the Secretary of the Army
InventorsJoseph Murphy, William A. Hester
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Abstract
Smooth layers of a metal are produced on a glass substrate where a large ferential expansion coefficient of the metal relative to the substrate produces very large stresses in the metal when the metallized substrate is subjected to a post deposition anneal. The method involves depositing a layer of a metal having a very small self diffusion coefficient at the anneal temperature prior to depositing the metal having the large differential expansion coefficient.
Claims10
Method of producing a smooth layer of a metal on a glass substrate wherein a large differential expansion coefficient of the metal relative to the substrate produces very large stresses in the metal when the metallized substrate is subjected to a post deposition anneal, said method comprising depositing a layer of a metal having a very small self diffusion coefficient at the anneal temperature prior to depositing the metal having the large differential expansion coefficient.
Method of producing a smooth layer of aluminum on a glass substrate comprising depositing a layer of copper before depositing the aluminum so that the aluminum will be able to flow into the copper and will not develop spikes when the metallized substrate is subjected to a post deposition anneal.
Method of producing a smooth layer of aluminum on a glass substrate comprising depositing a layer of copper before depositing the aluminum, the layer of copper being deposited in such an amount that the migration rate through the copper is greater than the migration rate in the aluminum when the metallized substrate is subjected to a post deposition anneal.
Method of producing a smooth layer of aluminum of about 600 to 1200 angstroms in thickness on a glass substrate consisting of electron beam depositing a layer of copper of about 300 to 600 angstroms in thickness before depositing the aluminum so that the aluminum will be able to flow into the copper and will not develop spikes when the metallized substrate is subjected to a post deposition anneal.
Dependencies are inferred from the claim text.