Method and apparatus for assembling, shipping and testing sensitive electronic components

Abstract

A container for handling small sensitive electronic components having lugs to which wires may be attached, is disclosed. The container is comprised of cardboard having a conductive metallic coating on a surface thereof. The container has a portion (i.e., a hump) on which the electronic components are securely placed so that the lugs are all electrically interconnected by said metallic coating. The fact that the coating interconnects all of the lugs, prevents build-up of static electricity which might injure the electronic component. The electronic components can be easily tested by removing the top portion of the container and by inserting non-conductive inserts between the portion of the container to which the electronic components are secured and the electronic components. Test probes can then be brought into contact with the electronic components. In manufacture, a base or lower part of a component's casing having rigid leads (lugs) depending downwardly is first positioned such that the lugs grip said hump. An integrated circuit is then assembled on the base. The lugs may continuously remain on the hump throughout the entire process of assembly, shipment to the customer, and testing by the manufacturer and customer.

Dependencies are inferred from the claim text.