Plastic mount for a stamping die

A hollow plastic mount for a stamping die, said mount being defined by an elongated tubular base of rectangular cross section having closed ends, opposed top and bottom surfaces and opposed front and rear surfaces, said mount further including a generally tubular handle projecting upwardly from the center of said top surface of said base, the bottom surface of said base including a pair of longitudinally extending parallel lower ribs projecting downwardly from said bottom surface contiguous with the front and rear surfaces of said base respectively and defining a boundary for the placement of a stamping die, said mount formed from unitary front and rear segments defined by a central vertical plane extending parallel to the longitudinal axis of said base, said front and rear segments being connected together, with said front segment further including a means, cooperating with the lower rib formed on said front segment, adapted to receive a longitudinally extending C-shaped, transparent strip along the front surface of said base, such that a card bearing incicia identifying said stamping die may be readily displayed by interposing said card between said strip and the front surface of said base, said means including a pair of longitudinally extending rib portions projecting upwardly from the upper surface of said base contiguous with the front surface thereof, said rib portions being spaced apart such that a separation is defined therebetween, said separation being aligned with said handle and being at least as large as the longitudinal width of said handle at its juncture with said base, said rib portions cooperating with the lower rib formed on said front segment to receive and hold said transparent strip.