An electrical and thermal interconnection system for electronic circuit boards arranged in a cabinet, comprising at least one mother board constituted by an insulating support with printed conductors and two external metallic layers isolated from these conductors, and which is carried by slides attached to the side wall of the cabinet, rectangular daughter boards comprising a thermal collector, including in addition:
- zero insertion force electrical and thermal connectors each comprising electrical connection conductors and thermal conduction means, these conduction means being constituted by a metallic base and a metallic longitudinal wall, these connectors being applied by their bases to an external metallic layer of at least one mother board, other electrical and thermal connectors of this type being mounted by their metallic bases onto the other external layer of this mother board, and wherein the daughter boards comprising a thermal collector are each engaged by at least one longitudinal edge in an electrical and thermal connector such that the thermal collector of a daughter board is applied against the surface of the longitudinal metallic wall of a single electrical and thermal connector, the connection conductors of these connectors being connected electrically to the printed conductors on the daughter boards and mother board.