Ultrasonic transducer and process to obtain high acoustic attenuation in the backing
AssigneeGeneral Electric Company
InventorCasmir R. Trzaskos
Life of this patent
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Abstract
A high frequency ultrasonic transducer is improved by fabricating the tungsten-polyvinyl chloride composite, which backs the elements, in a specific manner. Small particle size tungsten powder and PVC powder are placed into a high pressure die. Standard processing of the powder mixture includes degasing followed by heating and compressing. To maximize the acoustic attenuation, the pressure applied to the mixture is maintained until it has cooled down. The composite is in a state of elastic compression and spontaneously expands when removed from the die, giving rise to the high levels of acoustic attenuation.
Claims5
A process for enhancing the acoustic attenuation of a tungsten-polyvinyl chloride ultrasonic transducer backing material comprising:
- placing a mixture of tungsten powder and polyvinyl chloride powder into the chamber of a high pressure die, said tungsten powder having a particle size less than 10 microns and the volume ratio of tungsten to polyvinyl chloride being selected to yield a specific acoustic impedance;
- evacuating the die chamber to degas said powders;
- heating said powder mixture for a limited time and applying a pressure that is increased to a high pressure sufficient to compress said powders into a dense, compact composite;
- continuing to apply said high pressure until said composite cools down to below 50.degree. C. and is in a state of elastic compression;
- and
- removing said cooled composite from the die so that said composite spontaneously expands and acquires high levels of acoustic attenuation.
Dependencies are inferred from the claim text.