Aluminium electroplating solution
AssigneeU.S. Philips Corporation
InventorsTheo E. G. Daenen, Gerardus A. R. van Dijk, Steven A. Stolk
Life of this patent
Estimating the term…
Abstract
Electrolyte liquid for the electrodeposition of aluminium, containing lithium hydride and/or lithium aluminium hydride and at least one aluminium halide dissolved in tetrahydrofuran or halogen and/or methyl derivatives, the molar ratio between the Al-halide and the lithium aluminium hydride being in excess of 3. In addition, this bath contains an alkali metal aluminium chloride. This liquid is conspicuous for its high conductivity and its great stability.
Claims7
An electrolyte bath for the electrodeposition of ductile aluminum on a substrate, containing lithium hydride and/or lithium aluminum hydride and at least one aluminum halide, dissolved in tetrahydrofuran or halogen and/or methyl derivatives thereof, characterized in that n, defined as
- n=(X-1/4Z)/(Y+1/4Z)
- wherein
- X is the total number of moles of dissolved aluminum halide,
- Y is the total number of moles of dissolved lithium aluminum hydride,
- Z is the total number of moles of lithium hydride,
- is greater than 3 and an effective quantity exceeding 0.35 moles/l of alkali metal aluminum chloride is added to the bath.
Dependencies are inferred from the claim text.