Heat resistant resin composition
AssigneeMitsubishi Monsanto Chemical Company
InventorSadao Ikuma
Life of this patent
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Abstract
A heat resistant resin composition comprises 10 to 90 wt. % of a copolymer (A) having 15 to 50 wt. parts of N-phenylmaleimide component, 85 to 40 wt. parts of a vinyl aromatic monomer component and 0 to 30 wt. parts of a vinyl comonomer component to be 100 wt. parts in total; and 90 to 10 wt. % of a copolymer (B) having 15 to 30 wt. parts of a cyanovinyl monomer component, 85 to 65 wt. parts of a vinyl aromatic monomer component and 0 to 30 wt. parts of a vinyl comonomer component.
Claims7
A heat resistant resin composition which consists essentially of 10 to 90 wt. % of a copolymer (A) having 15 to 50 wt.parts of N-phenylmaleimide component, 85 to 40 wt.parts of a vinyl aromatic monomer component and 0 to 30 wt.parts of a vinyl comonomer component to be 100 wt.parts in total, which is obtained by imidization of vinyl aromatic/maleic anhydride copolymer with an aromatic amine;
- and 90 to 10 wt. % of a copolymer (B) having 15 to 30 wt.parts of a cyanovinyl monomer component, 85 to 65 wt.parts of a vinyl aromatic monomer component and 0 to 30 wt.parts of vinyl comonomer component.
Dependencies are inferred from the claim text.