Zero insertion force connector for integrated circuit packages

A zero insertion force connector for receiving the interface pins of an integrated circuit package comprising:

• a plurality of electrical contacts, each of said contacts being comprised of a pair of opposing cantilever beam-type members joined at one end to form a common extremity, each of said last mentioned members having at least one finger extension contoured to engage the surface of an interface pin during operation of the integrated circuit package, the finger extensions of the respective beam-type members defining a pin-receiving area therebetween,
• a base having a plurality of cavities for receiving respectively said plurality of electrical contacts, said cavities having a pair of opposing tapered walls, said electrical contacts being formed such that upon installation in said cavities, said beam-type members tend to move respectively toward said tapered walls, causing the finger extensions to move toward each other and to restrict said pin-receiving area,
• at least one contact release plate having a plurality of cam-like apertures, means for slidably mounting said contact release plate within said base, said cam-like apertures encompassing respectively said plurality of electrical contacts, the movement of said contact release plate to an "open" position causing the opposite surfaces at one extremity of each of said cam-like apertures to contact the respective beam-type members of a contact and to squeeze them toward each other, thereby causing said finger extensions to move apart, said finger extensions substantially encompassing an interface pin inserted within said pin-receiving area, movement of said contact release plate to a "closed" position permitting said beam-type members to move away from each other without contacting the opposite surfaces at the other extremity of each of said cam-like apertures, thereby causing said finger extensions to move toward each other and to grip the surface of said interface pin,
• a cover member disposed over said contact release plate and affixed to said base in a manner to prevent its movement relative thereto, said cover member having a plurality of apertures homologously positioned with respect to the longitudinal center lines of the pin-receiving area of said contacts, the dimensions of each of said apertures providing an exact fit with respect to the cross sectional dimensions of said interface pin, said last mentioned apertures directing each of said interface pins to enter the central portion of said pin-receiving area when said integrated circuit package is mounted in said connector.