Semiconductor unit with connecting wires
AssigneeW. C. Heraeus GmbH
InventorAlbrecht Bischoff
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Abstract
To reduce failure and breakage of connecting wires connecting specific zones on semiconductor chips to semiconductor frames, the connecting wires are made of an aluminum-copper alloy having, by weight, 3 to 5%, preferably 4% copper, the remainder aluminum (neglecting incidental impurities), the diameter of the wires being between about 0.01 to 0.06 mm, preferably about 0.02 to 0.05 mm, connected to the frame and the semiconductor, respectively, by ultrasonic bonding.
Claims8
A semiconductor unit comprising
- a semiconductor chip (11);
- a connecting frame (15, 15');
- and means connecting selected zones of the semiconductor chip to the frame comprising, in accordance with the invention,
- connecting lead wires consisting of a homogeneous aluminum-copper alloy, having a thickness of between about 0.01 mm to 0.06 mm, and in which the aluminum alloy consists essentially of 3 to 5% copper, the balance aluminum, by weight.
A connecting wire, particularly for connection of semiconductor elements to semiconductor frame terminal members and consisting of a homogeneous aluminum alloy which, essentially, has 3 to 5% copper, the remainder aluminum, and has a diameter of between 0.01 to 0.06 mm.
Dependencies are inferred from the claim text.