Radiation protection for integrated circuits utilizing tape automated bonding
AssigneeFairchild Camera and Instrument Corporation
InventorWilliam S. Phy
Life of this patent
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Abstract
A technique is disclosed for protecting integrated circuits from alpha particles. A central portion of a radiation resistant insulating substrate upon which electrically conductive leads are disposed is positioned in proximity to the integrated circuit. When the leads are electrically connected to the integrated circuit, the central portion of the substrate is allowed to remain over the integrated circuit to protect the integrated circuit. The insulating substrate typically comprises a polyimide film resistant to alpha particles.
Claims8
A composite structure for use in fabricating electrical connections to an integrated circuit comprising:
- an insulating substrate having a central portion adapted to be disposed in proximity to the surface of the integrated circuit and having a peripheral portion disposed about at least part of the central portion, the peripheral portion being separated from the central portion at selected locations;
- and
- a pattern of electrically conductive material disposed on at least the peripheral portion of the insulating substrate whereby the pattern of electrically conductive material is adapted to be connected to the integrated circuit where the peripheral portion is separated from the central portion, and the central portion of the insulating substrate is disposed in proximity to the integrated circuit.
Dependencies are inferred from the claim text.