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AssigneeE. I. Du Pont de Nemours and Company
InventorsRichard H. Carlson, Gerald L. Gatcomb
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A process for embossing flexible polymeric substrates in a dielectric heating press having a platen and a design fixture by placing an insulating blanket of a composite sheet structure between the substrate being embossed and the platen of the press and embossing the substrate; wherein the composite sheet structure is an aromatic polyamide fabric coated on both sides with a 2-30 mil thick layer of a fluorosilicone rubber and having a dielectric constant of about 4-8 and a dissipation factor of about 0.015-0.030; the polymeric substrates generally are laminates of thermoplastic polyurethane form/short napped synthetic velour fabric used as upholstery for automobiles and trucks.
A process for embossing flexible polymeric substrates in a dielectric heating press having a platen and a design fixture by placing a composite sheet structure between the substrate being embossed and the platen of the press and embossing the substrate wherein the composite sheet structure comprises a layer about 2-30 mils thick of a fluorosilicone rubber firmly adhered to both side of an aromatic polyamide fabric and having a dielectric constant of about 4-8 and a dissipation factor of about 0.015-003 where the dielectric constant and dissipation factor are determined at one megahertz frequency according to ASTMD-1531.
Dependencies are inferred from the claim text.