Heat resistant resin composition and insulating wire using the same which is a composition of an active hydrogen compound and the reaction product of a polyvalent isocyanate and a polyvalent carboxylic acid anhydride in an organic solvent
AssigneeHitachi Chemical Company, Ltd.
InventorsYasunori Okada, Shozo Kasai
Life of this patent
Estimating the term…
Abstract
A resin composition comprising (A) a reaction product obtained by reacting (a) a polyvalent isocyanate, (b) a polyvalent carboxylic acid anhydride, and if necessary, (c) a polyvalent carboxylic acid, in an organic solvent, and (B) a compound having active hydrogen in the molecule except for a phenolic compound, shows excellent heat resistance and storage stability. Insulated wires obtained by coating said resin composition on an electric conductor directly or indirectly are advantageously produced.
Claims18
A heat resistant resin composition comprising:
- (A) a reaction product obtained by reacting
- (a) a polyvalent isocyanate having two or more isocyanate groups in the molecule,
- (b) a polyvalent carboxylic acid having one or more acid anhydride groups in the molecule or a functional derivative thereof, and, if necessary,
- (c) A polyvalent carboxylic acid having two or more carboxyl groups in the molecule or a functional derivative thereof,
- in an organic solvent, and
- (B) a compound having one or more active hydrogens in the molecule except for a phenolic compound,
- said composition being able to be heated or not heated;
- and
- from 0.1 to 10% by weight of said compound (B), based on the weight of the reaction product (A) being added to reaction product (A) to form said composition.
A heat resistant resin composition comprising:
- (A) a reaction product obtained by reacting
- (a) a polyvalent isocyanate having two or more isocyanate groups in the molecule,
- (b) a polyvalent carboxylic acid having one or more acid anhydride groups in the molecule or a functional derivative thereof, and, if necessary,
- (c) a polyvalent carboxylic acid having two or more carboxyl groups in the molecule or a functional derivative thereof,
- in an oranic solvent, and
- (B) n-butylamine, n-propylamine, isopropylamine, isobutylamine, or t-butylamine or a mixture thereof,
- said composition being able to be heated or not heated.
A heat resistant resin composition comprising:
- (A) a reaction product obtained by reacting
- (a) a polyvalent isocyanate having two or more isocyanate groups in the molecule,
- (b) a polyvalent carboxylic acid having one or more acid anhydride groups in the molecule or a functional derivative thereof, and, if necessary,
- (c) a polyvalent carboxylic acid having two or more carboxyl groups in the molecule or a functional derivative thereof,
- in an organic solvent, and
- (B) n-butanol, isopropanol, methanol, ethanol, n-propanol, or isobutanol or a mixture thereof,
- said composition being able to be heated or not heated.
A heat resistant resin composition comprising:
- (A) a reaction product obtained by reacting
- (a) a polyvalent isocyanate having two or more isocyanate groups in the molecule,
- (b) a polyvalent carboxylic acid having one or more acid anhydride groups in the molecule or a functional derivative thereof, and, if necessary,
- (c) a polyvalent carboxylic acid having two or more carboxyl groups in the molecule or a functional derivative thereof,
- in an organic solvent, and
- (B) acetic acid or propionic acid, or a mixture thereof,
- said composition being able to be heated or not heated.
Dependencies are inferred from the claim text.