Process for cleaning copper-containing metal surfaces
AssigneeHoechst Aktiengesellschaft
InventorsWalter Herwig, Kurt Klupfel, Helga Sikora, Heide Sprengel
Life of this patent
Estimating the term…
Abstract
A process and an aqueous treatment solution for cleaning copper surfaces, in particular for removing residues of photoresist layers, which residues still adhere after development to the cleared copper areas, are described. The solution contains a water-soluble aliphatic sulfonic acid having 8 to 30 carbon atoms or a water-soluble salt thereof.
Claims9
In the process for the production of a photoresist image, in which a photopolymerizable photoresist layer is applied to a support of copper or a copper alloy, is exposed imagewise and is washed out of the unexposed areas by means of an aqueous-alkaline developer solution,
- the improvement which comprises treating the surface of the support, after the development as a separate cleaning step, with a solution which contains a water-soluble aliphatic sulfonic acid, or a water-soluble salt of such a sulfonic acid, having 8 to 30 carbon atoms, the photoresist stencil remaining unattacked during this cleaning step.
Dependencies are inferred from the claim text.