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US 4,379,279 AGranted
Submersible pressure transducer package
AssigneeNational Semiconductor Corporation
InventorSaeed Nasiri
Life of this patent
Estimating the term…
Abstract
A submersible pressure transducer package includes a housing having first and second separate chambers with a pressure responsive silicon transducer mounted in one of the chambers, an isolation fluid filling each chamber and sealed therein by means of a diaphragm with the separate bodies of fluid contacting separate portions of the pressure responsive silicon transducer with ports communicating working fluid pressure and ambient pressure to the bodies of fluid for transmittal thereof to the transducer.
Claims4
A submersible pressure transducer comprising in combination:
- a generally cylindrical housing having first and second substantially cylindrical chambers formed in opposite ends therein and disposed coaxially of said housing;
- a cylindrical bore communicating between said chambers;
- a pressure responsive silicon transducer chip mounted in a fixed position in a first one of said chambers and having first a portion subject to pressure in said first chamber and a second portion thereof communicating via said bore and subject to pressures in said second chamber;
- a diaphragm sealingly closing each of said chambers;
- a separate body of isolation fluid of substantially equal volumes filling each of said chambers and contacting a respective one of said first and second portions of said transducer chip;
- and
- first and second pressure ports for communicating a reference fluid and a pressure fluid to a respective one of said diaphragms for establishing a responsive pressure on said transducer chip.
4 more elements
Dependencies are inferred from the claim text.