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US 4,379,199 AGranted
Heat-resisting layer-constructions and method for preparing the same
AssigneesYokohama Kiko Co., Ltd., NHK Spring Co., Ltd.
InventorsSusumu Senaha, Tetsuya Chiba, Akira Ohno, Shitomi Katayama
Life of this patent
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Abstract
The present invention relates to heat-resisting layer-constructions consisting of base substrates such as plates, boards and sheets, and silicone polymers having high contents of aryl radicals painted and thermally cured to adhere on the surfaces of the base substrates, and the method of preparing the same.
Claims5
Heat resisting layer-constructions consisting of
- (a) a heat resistant, base substrate and
- (b) a resinous layer coated and heat cured on said substrate,
- said resinous layer (b) comprising a polyaralkylsiloxane comprising structural units having the general formula (I) ##STR2## wherein R is a lower alkyl radical;
- Ar is an aryl radical;
- X is a polycondensable functional radical;
- x, y and z, each represents the molar proportion of the unit for which it is the subscript, respectively, and wherein the free bonds in each of the structural units shown in the general formula (I) are selected from the radicals as defined for R, Ar and X, or may combine with one another to form a bridging bond or may be a mono-functional radical, so long as the numerical molar fraction:
- ##EQU1## in said polyaralkylsiloxane having the general formula (I) is from 0.65 to 1.00,
- the functionality of the polycondensable functional groups in said polyaralkylsiloxane having the general formula (I) is from 2 to 3, and
- the ratio of the number of carbon atoms to the number of silicon atoms in said polyaralkylsiloxane having the general formula (I) is from 4.25 to 16.
6 more elements
Dependencies are inferred from the claim text.