Aluminum electroplating solution
AssigneeU.S. Philips Corporation
InventorsTheo E. G. Daenen, Gerardus A. R. Van Dijk, Steven A. Stolk
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Abstract
Electrolyte liquid for the electrodeposition of aluminum, consisting of a solution of a ligand of one or more aluminum halohydrides in an aprotic solvent. The ligand is, for example, tetrahydrofuran or triethylamine. This liquid makes it possible to deposit ductile aluminum up to high current densities.
Claims5
An electrolyte liquid for the electrodeposition of aluminum onto a substrate, which liquid contains an organic complex of an aluminum halohydride, characterized in that the liquid consists of a solution of one or more compounds AlH.sub.x Cl.sub.y.tL in a aprotic solvent having the structure
- R[O--(CH.sub.2).sub.m ].sub.p --O--(CH.sub.2).sub.n --OR.sup.1,
- wherein
- x+y=3 and both x and y amount to at least
- 0.25 and not more than 2.75,
- t is an integer selected from 1, 2, 3 or 4
- L is a ligand forming a coordination compound with the halohydride,
- R and R.sup.1 are alkyl groups and
- m and n are integers between 1 and 6 and
- p has a value of 1, 2 or 3.
Dependencies are inferred from the claim text.