# US 4,378,902 A · Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 4,378,902 A
- Document ID: US4378902A
- Status: Granted
- Kind: A
- Application number: 06/235,327
- Filed: 1981-02-17
- Granted: 1983-04-05
- Earliest claimed: 1981-02-17
- Assignees: The Jade Corporation
- Inventors: Tibor Fedak
- Web page: https://patentgrep.com/patent/US4378902A

## CPC

- H10W 72/075: {of bond wires}
- H10W 72/0711: {Apparatus therefor}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07521: {Aligning}
- H10W 72/50: Bond wires
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/581: {Auxiliary members, e.g. flow barriers}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- Y10S 228/904: Wire bonding
- Y10T 29/49121: Beam lead frame or beam lead device
- Y10T 29/49179: by metal fusion bonding
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In an apparatus for the assembly of microcomponents semiconductor devices, an improvement is provided for the step involving wire bonding of thin gold wires between conductor pads on the semiconductor chip and the external leads. In this type of apparatus generally, the wire bonding step involves the bonding of thin gold conductor wires between the conductor pads and the external leads. In the type apparatus wherein the present invention is provided, a lower anvil articular upward to a position underneath and supporting the semiconductor chip during the bonding process and then articulates downward away from the chip after bonding. The wires are placed and bonded by a capillary tube which articulates between positions above the bonding pads of the chip and the leads. The improvement comprises a wall disposed from the lower anvil and surrounding the chip between the conducting pads and the leads, whereby the wires are supported by the wall as they are withdrawn from the capillary tube.

## Claims

### Claim 1

In an apparatus for the assembly of microcomponent semiconductor devices wherein there is accomplished a step in which thin conductor wires are bonded between bonding pads on a semiconductor chip and leads for connecting the semiconductor or device to an external circuit, wherein a capillary tube from which the wire is drawn articulates between positions above a bonding pad of the chip and above a corresponding lead, and wherein a lower anvil reciprocates upward to a position underneath and supporting the chip during the bonding step and then downward away from the semiconductor chip after the bonding step, the improvement comprising a vertical wall projecting upwardly from the upper surface of the lower anvil and surrounding the chip between the bonding pads and the leads during the bonding step, the vertical height of the wall being greater than the vertical height of the chip and the leads so that the wires, after being bonded to the bonding pads, are supported by the wall as the wires are withdrawn from the capillary tube and bonded to the leads.