High temperature electrical connection and method of producing same
AssigneeUop LLC
InventorsEdward P. Habdas, Jon D. Aaron, Timothy H. Whitten
Life of this patent
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AssigneeUop LLC
InventorsEdward P. Habdas, Jon D. Aaron, Timothy H. Whitten
Estimating the term…
Improved lead attachment method accommodates a situation wherein electrical signal leads must be connected to portions of a circuit operating at high temperatures such as 900.degree. F. or more and terminate in equipment operating at or near ambient temperatures. For example, in solid electrolyte oxygen sensors incorporating a tubular ceramic member, a connection wire which is sufficiently thick to resist wire breakage during normal handling has been found to be too thick to bond to a connection pad on the ceramic without having the bond crack during thermal cycling. With improved method, a thin wire is attached to a thicker one in a region where flexing cannot occur. At least the larger wire is shrunk-fit into a hole formed in the ceramic before firing, and then the thinner wire is bonded to the pad with a conductive paste which must also be fired.
In an oxygen sensor device of the type having a solid electrolyte sensing portion coated with electrodes and a fused conductive glass frit paste lead stripe joining at least one of said electrodes to a remote, terminal connection surface of a generally tubular ceramic housing, the improvement comprising an opening in said housing adjacent said remote terminal connection surface, said opening having at least portions of its internal wall surface in tight shrink-fit engagement with a portion of a primary lead connection wire having a diameter of at least 0.015", said lead connection wire being of a material capable of withstanding the firing and operational temperatures of said ceramic housing and of sufficient thickness to resist breakage from flexure during handling, a secondary lead attachment wire joined at one of its ends to said primary lead connection wire at a location where said primary wire connot flex, the other end of said secondary wire being joined by a layer of fused, conductive glass frit paste to said lead stripe, said secondary wire having a thickness of less than about 0.010" which is sufficient to permit it to remain firmly bonded to said lead stripe, despite continual thermal cycling over the life of the device.
Dependencies are inferred from the claim text.