Substrate for magnetic domain device

Field-accessed magnetic domain device package apparatus comprising:

• plural input/output package terminals,
• planar magnetic ceramic first member means for providing a magnetic bias field source,
• plural conductors directly affixed to and supported by said first member means,
• at least one planar magnetic domain device having plural input/output device terminals, said first member means supporting said magnetic domain device in a predetermined superimposed relationship thereto by selectively bonding said input/output device terminals to said plural conductors, said plural conductors being further selectively coupled to said input/output package terminals,
• magnetic circuit second member means coacting with said first member means to provide a magnetic bias field for said domain device,
• a rotational magnetic field coil system for providing a rotational magnetic field for said device, said system having first and second orthogonal coils, said first member means and said device mounted thereon being disposed within said first coil and said second coil being disposed about said first coil in an orthogonally wound relationship, and
• insulator carrier third member means for carrying said input/output package terminals, said third member means being external to said second member means.

Field accessed magnetic domain device package apparatus of the pluggable type, said apparatus comprising:

• plural input/output package terminal pins,
• planar magnetic ceramic first member means for providing a magnetic bias field source,
• plural conductors directly affixed to and supported by said first member means,
• plural planar magnetic domain devices, each of said devices having plural input/output device terminals, said first member means supporting said magnetic domain devices in a predetermined superimposed relationship thereto by selectively bonding said input/output device terminals to said plural conductors, said plural conductors being further selectively coupled to said input/output package terminal pins,
• a rotational magnetic field coil system for providing a rotational magnetic field for said devices, said system having first and second orthogonal coils, said first member means and said devices mounted thereon being disposed within said first coil and said second coil being disposed about said first coil in an orthogonally wound relationship,
• magnetic circuit second member means disposed about said second coil, said magnetic circuit second member means coacting with said first member means to provide a magnetic bias field for said domain device, and
• insulator carrier third member means for carrying said input/output package terminal pins, said third member means being external to said second member means.

A magnetic bubble memory package comprising:

• a plurality of electrical input/output terminals,
• at least one magnetic bubble memory chip,
• a magnetic field coil system for providing a moving magnetic field through said chip,
• a magnetic circuit member, a substrate for physically supporting said chip, said substrate being formed of nonconducting magnetic ceramic material which in co-action with said magnetic circuit member provides a bias field through said chip,
• a plurality of conductors on said substrate,
• electrical connections between said chip and said conductors, and between said conductors and said terminals,
• whereby said substrate provides a physical support for said chip, a source of magnetic bias field for said chip, and direct physical support for said terminals and said conductors connecting the chip to said terminals, said terminals being supported by said substrate external to said magnetic circuit member.