High density interconnection means for chip carriers
AssigneeInternational Business Machines Corporation
InventorsMario E. Ecker, Leonard T. Olson
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Abstract
A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.
Claims7
A connecting system for semiconductor devices which comprises:
- a semiconductor carried on one major surface of a substrate, said semiconductor being in selective electric contact through said substrate with an opposed major surface of said substrate;
- a flexible, extendable, synthetic resinous membrane attached to the opposed major surface of said substrate, said membrane carrying internally a conductive metal pattern which is in selective electrical contact with said semiconductor through said substrate, said membrane having an area greater than said substrate and, in the area thereof exterior the periphery of said substrate, being provided with electrical contacts in electrical communication with said conductive metal pattern;
- a printed circuit card in electric contact with said semiconductor by way of electrical contacts in said printed circuit card which complement the electrical contacts in the periphery of said membrane and are in electric contact therewith;
- and
- biasing means between said substrate and said printed circuit card, said biasing means maintaining said semiconductor and said printed circuit card in thermal and electrical contact and separating said substrate and said printed circuit card.
Dependencies are inferred from the claim text.