Method of applying photoresist by screening in the formation of printed circuits
OwnerMichael J. Oddi, Alfred P. Orioinventors
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Abstract
This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.
Claims18
In a method for the formation of a printed circuit comprising the steps of applying a layer of light sensitive photoresist material over a substrate, drying the photoresist material to form a dry layer, exposing the photoresist layer to activating radiation, developing the photoresist to form a relief image and permanently modifying the substrate in a desired printed circuit pattern, the improvement whereby said light sensitive photoresist is applied to said substrate by screening the same onto said substrate through a screen fabric in an incomplete circuit pattern.
Dependencies are inferred from the claim text.