Method of producing structures composed of photosensitive resist for integrated semiconductor circuits
AssigneeSiemens Aktiengesellschaft
InventorReiner Sigusch
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Abstract
Structures composed of photosensitive resist are produced for semiconductor circuits by first generating a mask of a photosensitive resist onto a substrate and then applying a layer of a photosensitive resist over the entire surface of the substrate, including the first generated mask, so that such mask dissociates or dissolves by the material of the subsequently applied layer, which is then structured. In this manner, an improved adhesion of the resist structures to the substrate is achieved and simultaneously cleansing steps are eliminated. The inventive process is utilized for all processes during manufacture of semiconductor circuits wherein at least two photolithographic processes occur without the intervention of a high temperature step.
Claims10
In a method of producing structures composed of photosensitive resist layers on substrates provided for integrated semiconductor circuits wherein during the manufacture of such circuits, the production of structures functioning as masks occurs successively without the intervention of a high temperature process, the improvement consisting of the sequential steps of:
- applying a photosensitive resist onto a substrate, generating a desired first mask structure therefrom and utilizing said mask to apply a select material onto said substrate;
- applying a layer of a photosensitive resist onto the entire surface area of said substrate, including said mask structure;
- said photosensitive resist utilized to generate said first mask structure and said photosensitive resist applied as a layer thereon containing similar solvent components so that at least a portion of said first mask structure disassociates into said layer or is removed by said solvent component;
- and
- adjusting the thickness of said layer to a desired value, structuring said layer into a desired second mask structure and utilizing said second mask to apply a select material onto said substrate.
Dependencies are inferred from the claim text.