Methods for applying solder to an article
AssigneeWestern Electric Company, Inc.
InventorThaddeus Wojcik
Life of this patent
Estimating the term…
Abstract
A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area (34) while maintaining the thickness thereof.
Claims3
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of:
- (a) forming a thick layer of cured solder paste on the conductive portion;
- (b) applying a hard coating over said cured solder paste to confine the thick layer of cured solder paste;
- (c) reflowing the solder, while confined, to bond the solder to the conductive portion;
- and
- (d) removing the hard confining coating.
A method of forming a thick deposit of solder on an electrically conductive portion of a metallized substrate, the method comprising the steps of:
- (a) depositing a thick layer of solder paste on the conductive portion;
- (b) subjecting the thick layer of solder paste to an elevated temperature to cure said paste;
- (c) applying a hardenable coating to the cured solder paste;
- (d) hardening the coating;
- (e) reflowing the solder, while confined within the hardened coating, to bond the solder to the conductive portion;
- and
- (f) removing the hard coating.
A method of bonding a thick, upstanding, solder blob on an electrically conductive land area of a metallized substrate, the method comprising the steps of:
- (a) depositing a thick, upstanding, solder paste blob on the land area;
- (b) curing the solder paste blob at an elevated temperature for a predetermined time;
- (c) coating the solder paste blob with a hardenable material;
- (d) curing the coating to harden the material;
- (e) reflowing the coated solder to bond the solder blob to the land area;
- and
- (f) removing the hardened coating, leaving a thick upstanding solder blob bonded to the land area.
Dependencies are inferred from the claim text.